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Huai-Hui Ren
Publication Activity (10 Years)
Years Active: 2011-2017
Publications (10 Years): 1
Top Topics
Infrared
Simulation Study
Structural Properties
Behavior Patterns
Top Venues
Microelectron. Reliab.
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Publications
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Zhi-Hao Zhang
,
Xi-Shu Wang
,
Huai-Hui Ren
,
Su Jia
,
Hui-Hua Yang
Simulation study on thermo-fatigue failure behavior of solder joints in package-on-package structure.
Microelectron. Reliab.
75 (2017)
Xi-Shu Wang
,
Su Jia
,
Huai-Hui Ren
,
Pan Pan
Effects of solder balls and arrays on the failure behavior in Package-on-Package structure.
Microelectron. Reliab.
54 (3) (2014)
Huai-Hui Ren
,
Xi-Shu Wang
,
Su Jia
Fracture analysis on die attach adhesives for stacked packages based on in-situ testing and cohesive zone model.
Microelectron. Reliab.
53 (7) (2013)
Xi-Shu Wang
,
Xu-Dong Li
,
Huai-Hui Ren
,
Hai-Yan Zhao
,
Ryosuke Murai
SEM in situ study on high cyclic fatigue of SnPb-solder joint in the electronic packaging.
Microelectron. Reliab.
51 (8) (2011)