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Effects of solder balls and arrays on the failure behavior in Package-on-Package structure.

Xi-Shu WangSu JiaHuai-Hui RenPan Pan
Published in: Microelectron. Reliab. (2014)
Keyphrases
  • structural information
  • failure rate
  • data structure
  • structural properties
  • software package
  • behavior patterns
  • artificial intelligence
  • infrared
  • dynamic behavior