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Simulation study on thermo-fatigue failure behavior of solder joints in package-on-package structure.

Zhi-Hao ZhangXi-Shu WangHuai-Hui RenSu JiaHui-Hua Yang
Published in: Microelectron. Reliab. (2017)
Keyphrases
  • simulation study
  • software package
  • structural properties
  • artificial neural networks
  • monte carlo
  • behavior analysis
  • image segmentation
  • bayesian networks
  • xml documents
  • behavior patterns