Edmund D. Blackshear

Publication Activity (10 Years)

Years Active: 2005-2019
Publications (10 Years): 1

Top Topics

Lessons Learned

Computational Complexity

Top Venues

Publications

Zhuo-Jie Wu, Manish Nayini, Charles Carey, Samantha Donovan, David Questad, Edmund D. Blackshear
CPI Reliability Challenges of Large Flip Chip Packages and Effects of Kerf Size and Substrate. IRPS (2019)
Edmund D. Blackshear, Moises Cases, Erich Klink, Stephen R. Engle, Ronald S. Malfatt, Daniel N. deAraujo, Stefano Oggioni, Luke D. Lacroix, Jamil A. Wakil, Nam H. Pham, Gareth G. Hougham, David J. Russell
The evolution of build-up package technology and its design challenges. IBM J. Res. Dev. 49 (4-5) (2005)