The evolution of build-up package technology and its design challenges.
Edmund D. BlackshearMoises CasesErich KlinkStephen R. EngleRonald S. MalfattDaniel N. deAraujoStefano OggioniLuke D. LacroixJamil A. WakilNam H. PhamGareth G. HoughamDavid J. RussellPublished in: IBM J. Res. Dev. (2005)