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CPI Reliability Challenges of Large Flip Chip Packages and Effects of Kerf Size and Substrate.

Zhuo-Jie WuManish NayiniCharles CareySamantha DonovanDavid QuestadEdmund D. Blackshear
Published in: IRPS (2019)
Keyphrases
  • high speed
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  • computational complexity
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  • data sets
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