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Doug C. H. Yu
Publication Activity (10 Years)
Years Active: 2014-2023
Publications (10 Years): 2
Top Topics
Power Saving
Data Handling
Metal Oxide Semiconductor
Ultra High
Top Venues
3DIC
CICC
VLSI Technology and Circuits
VLSI Circuits
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Publications
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Chih-Hang Tung
,
Doug C. H. Yu
An Integrated System Scaling Solution for Future High Performance Computing.
VLSI Technology and Circuits
(2023)
C. J. Wu
,
S. T. Hsiao
,
J. Y. Wang
,
W. H. Lin
,
C. W. Chang
,
T. L. Shao
,
C. H. Tung
,
Doug C. H. Yu
Ultra High Power Cooling Solution for 3D-ICs.
VLSI Circuits
(2021)
Chuei-Tang Wang
,
Jeng-Shien Hsieh
,
Victor C. Y. Chang
,
En-Hsiang Yeh
,
Feng-Wei Kuo
,
Hsu-Hsien Chen
,
Chih-Hua Chen
,
Huan-Neng Ron Chen
,
Ying-Ta Lu
,
Chewnpu Jou
,
Hao-Yi Tsai
,
C. S. Liu
,
Doug C. H. Yu
Power saving and noise reduction of 28nm CMOS RF system integration using integrated fan-out wafer level packaging (InFO-WLP) technology.
3DIC
(2015)
Doug C. H. Yu
New System-in-Package (SiP) Integration technologies.
CICC
(2014)