Power saving and noise reduction of 28nm CMOS RF system integration using integrated fan-out wafer level packaging (InFO-WLP) technology.
Chuei-Tang WangJeng-Shien HsiehVictor C. Y. ChangEn-Hsiang YehFeng-Wei KuoHsu-Hsien ChenChih-Hua ChenHuan-Neng Ron ChenYing-Ta LuChewnpu JouHao-Yi TsaiC. S. LiuDoug C. H. YuPublished in: 3DIC (2015)
Keyphrases
- noise reduction
- power saving
- power consumption
- nm technology
- cmos technology
- signal to noise ratio
- metal oxide semiconductor
- low power
- high speed
- silicon on insulator
- edge preserving
- integrated circuit
- edge detection
- noisy environments
- power reduction
- median filter
- energy efficiency
- computer systems
- energy saving
- real time
- parallel processing
- power dissipation
- cost effective
- low cost
- fine grained
- speech enhancement
- data management
- image segmentation