Alaa B. El-Rouby

Publication Activity (10 Years)

Years Active: 2011-2015
Publications (10 Years): 2

Top Topics

Ibm Zenterprise

Design Methodologies

Top Venues

Microelectron. J.

Publications

Karim Ali, Eslam Yahya, Alaa B. El-Rouby, Yehea I. Ismail
Library based macro-modeling methodology for Through Silicon Via (TSV) arbitrary arrays. Microelectron. J. 46 (12) (2015)
Kareem Ali, Eslam Yahya, Alaa B. El-Rouby, Yehea Ismail
Different scenarios for estimating coupling capacitances of through silicon via (TSV) arrays. ICEAC (2015)
Mohamed Mahmoud, Amr Wassal, Alaa B. El-Rouby, Rafik Guindi
Current source based standard-cell model for accurate timing analysis of combinational logic cells. ICECS (2013)
Khaled Salah, Alaa B. El-Rouby, Hani F. Ragai, Yehea I. Ismail
TSV-based on-chip inductive coupling communications. ISCAS (2013)
Khaled Salah, Alaa B. El-Rouby, Hani F. Ragai, Yehea I. Ismail
A closed form expression for TSV-based on-chip spiral inductor. ISCAS (2012)
Khaled Salah, Alaa B. El-Rouby, Hani F. Ragai, Yehea Ismail
Effect of non-uniform substrate doping profile on the electrical performance of through-silicon-via for low power application. ICEAC (2012)
Shaymaa M. Nabil, Alaa B. El-Rouby, Ahmed H. Khalil
An accurate power delivery system (PDS) design methodology for high-speed digital systems. Int. J. Circuit Theory Appl. 40 (1) (2012)
Khaled Salah, Alaa B. El-Rouby, Hani F. Ragai, Yehea I. Ismail
Modeling and analysis of through silicon via: Electromagnetic and device simulation approach. ICECS (2012)
Khaled Salah, Alaa B. El-Rouby, Hani F. Ragai, Karim Amin, Yehea I. Ismail
Compact lumped element model for TSV in 3D-ICs. ISCAS (2011)
Khaled Salah, Hani F. Ragai, Yehea I. Ismail, Alaa B. El-Rouby
Equivalent lumped element models for various n-port Through Silicon Vias networks. ASP-DAC (2011)
Khaled Mohamed, Alaa B. El-Rouby, Yehea I. Ismail, Hani F. Ragai
Body contact based TSV equalizer. IDT (2011)