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Effect of solder resist dissolution on the joint reliability of ENIG surface and Sn-Ag-Cu solder.

Hyunju LeeCheolmin KimCheolho HeoChiho KimJae-Ho LeeYangdo Kim
Published in: Microelectron. Reliab. (2018)
Keyphrases
  • mechanical properties
  • failure rate
  • finite element model
  • random variables
  • neural network
  • image segmentation
  • multiscale
  • viewpoint
  • experimental data
  • boundary conditions
  • printed circuit boards