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Yangdo Kim
ORCID
Publication Activity (10 Years)
Years Active: 2018-2018
Publications (10 Years): 1
Top Topics
Multiscale
Random Variables
Mechanical Properties
Top Venues
Microelectron. Reliab.
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Publications
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Hyunju Lee
,
Cheolmin Kim
,
Cheolho Heo
,
Chiho Kim
,
Jae-Ho Lee
,
Yangdo Kim
Effect of solder resist dissolution on the joint reliability of ENIG surface and Sn-Ag-Cu solder.
Microelectron. Reliab.
87 (2018)