Glass interposer with high-density three-dimensional structured TGV for 3D system integration.

Osamu Nukaga Tatsuya Shioiri Satoshi Yamamoto Tatsuo Suemasu

Published in: 3DIC (2013)

Keyphrases

high density
three dimensional
low density
close proximity
magnetic recording
high bandwidth
high power
data integration
data center
image sequences
structured data
thin film
depth map
range images
databases
x ray
field effect transistors
steady state
information integration
low cost
information systems