Thermal management and reliability of multi-chip power modules.
Guy LefrancGerhard MiticH.-J. SchultzPublished in: Microelectron. Reliab. (2001)
Keyphrases
- ibm power processor
- chip design
- management system
- power consumption
- information systems
- building blocks
- low cost
- infrared
- data processing
- information management
- thermal images
- high speed
- decision support
- high density
- power dissipation
- power management
- modular design
- network management
- decision making
- information technology
- analog vlsi
- vlsi implementation
- circuit design
- wireless sensor networks
- knowledge management