Login / Signup
Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads.
Petar Ratchev
Serguei Stoukatch
Bart Swinnen
Published in:
Microelectron. Reliab. (2006)
Keyphrases
</>
wire bonding
bond pad
mechanical properties
electron microscopy
low energy
facial expression recognition
experimental data
stress response
databases
learning algorithm
image processing