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Solder joint reliability evaluation of chip scale package using a modified Coffin-Manson equation.
Ikuo Shohji
Hideo Mori
Yasumitsu Orii
Published in:
Microelectron. Reliab. (2004)
Keyphrases
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high speed
failure rate
low cost
scale space
evaluation model
numerical solution
printed circuit boards
neural network
mathematical model
vlsi design