Login / Signup
Reliability study of board-level lead-free interconnections under sequential thermal cycling and drop impact.
Bo Zhang
Han Ding
Xinjun Sheng
Published in:
Microelectron. Reliab. (2009)
Keyphrases
</>
real world
wireless sensor networks
infrared
positive effects
databases
website
linear program
factors influencing
simplex method
influencing factors