A study on wafer level TSV build-up integration method.
Jae Hak LeeHyoung Joon KimJun-Yeob SongChang Woo LeeTae Ho HaPublished in: 3DIC (2013)
Keyphrases
- experimental study
- experimental evaluation
- computational cost
- dynamic programming
- cost function
- study proposes
- high accuracy
- significant improvement
- simulation study
- objective function
- multiscale
- synthetic data
- high precision
- fully automatic
- support vector machine svm
- main contribution
- similarity measure
- theoretical analysis
- prior knowledge
- evolutionary algorithm
- image processing
- mutual information
- model selection
- edge detection
- support vector machine
- probabilistic model
- optimization algorithm
- data fusion
- feature space
- preprocessing
- support vector
- regression analysis
- massively parallel