Jae Hak Lee

Publication Activity (10 Years)

Years Active: 2008-2013
Publications (10 Years): 0

Top Topics

Regression Analysis

High Reliability

Top Venues

Publications

Jun-Yeob Song, Jae Hak Lee, Hyoung Joon Kim, Chang Woo Lee, Tae Ho Ha
High reliability insert-bump bonding process for 3D integration. 3DIC (2013)
Jae Hak Lee, Hyoung Joon Kim, Jun-Yeob Song, Chang Woo Lee, Tae Ho Ha
A study on wafer level TSV build-up integration method. 3DIC (2013)
Jae Hak Lee, Choong D. Yoo, Jun-Yeob Song, Seung S. Lee, Sun-Rak Kim
A study on the edge traces technique for 3D stack chip. 3DIC (2011)
Jae Hak Lee, Yong Sun Kim, Duhgoon Lee, Dong-Goo Kang, Jong Beom Ra
Robust CCD and IR Image Registration Using Gradient-Based Statistical Information. IEEE Signal Process. Lett. 17 (4) (2010)
Yong Sun Kim, Jae Hak Lee, Jong Beom Ra
Multi-sensor image registration based on intensity and edge orientation information. Pattern Recognit. 41 (11) (2008)