Impacts of different shapes of through-silicon-via core on 3D IC performance.

Abdul Hamid Bin Yousuf Nahid M. Hossain Masud H. Chowdhury

Published in: ISCAS (2017)

Keyphrases

shape analysis
high speed
integrated circuit
low cost
shape descriptors
high density
shape classification
real time
genetic algorithm
three dimensional
shape model
line drawings
arbitrary dimension