Abdul Hamid Bin Yousuf

Publication Activity (10 Years)

Years Active: 2013-2018
Publications (10 Years): 4

Top Topics

Mechanical Properties

Shape Classification

Top Venues

J. Low Power Electron.

Publications

Emeshaw Ashenafi, Abdul Hamid Bin Yousuf, Masud H. Chowdhury
Investigation and Optimization of Spiral Inductor Design for On-Chip Buck Converter. J. Low Power Electron. 14 (1) (2018)
Abdul Hamid Bin Yousuf, Nahid M. Hossain, Masud H. Chowdhury
Impacts of different shapes of through-silicon-via core on 3D IC performance. ISCAS (2017)
Munem Hossain, Muhammad Sanaullah, Abdul Hamid Bin Yousuf, Azzedin Es-Saki, Masud H. Chowdhury
Analytical analysis of the contact resistance (Rc) of metal-MoS2 interface. MWSCAS (2015)
Abdul Hamid Bin Yousuf, Nahid M. Hossain, Masud H. Chowdhury
Performance analysis of through silicon via (TSV) and through glass via (TGV) for different materials. ISCAS (2015)
Nahid M. Hossain, MunEm Hossain, Abdul Hamid Bin Yousuf, Masud H. Chowdhury
Thermal aware Graphene based Through Silicon Via design for 3D IC. 3DIC (2013)