Login / Signup
Thermal aware Graphene based Through Silicon Via design for 3D IC.
Nahid M. Hossain
MunEm Hossain
Abdul Hamid Bin Yousuf
Masud H. Chowdhury
Published in:
3DIC (2013)
Keyphrases
</>
design process
design methodology
low cost
engineering design
design decisions
information retrieval
learning algorithm
case study
infrared
design principles
integrated circuit