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Interfacial reaction and mechanical evaluation in multi-level assembly joints with ENEPIG under bump metallization via drop and high speed impact test.

Hsiu-Min LinCheng-Ying HoWen-Lin ChenYi-Hsin WuDe-Hui WangJun-Ren LinYu-Hui WuHuei-Cheng HongZhi-Wei LinJenq-Gong Duh
Published in: Microelectron. Reliab. (2015)
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