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Inhomogeneous deformation and microstructure evolution of Sn-Ag-based solder interconnects during thermal cycling and shear testing.
Hongtao Chen
Jing Han
Jue Li
Mingyu Li
Published in:
Microelectron. Reliab. (2012)
Keyphrases
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mechanical properties
composite materials
high temperature
shear stress
finite element model
thermal conductivity
infrared
input output
material properties
test cases
finite element analysis
markov chain
neural network
finite element
mathematical model
linear programming
medical images
high speed
social networks