Login / Signup

Comparison of different flex materials in high density flip chip on flex applications.

Petteri PalmJarmo MäättänenYannick De MaquilléAlain PicaultJan VanfleterenBjörn Vandecasteele
Published in: Microelectron. Reliab. (2003)
Keyphrases
  • high density
  • low density
  • close proximity
  • high power
  • thin film
  • data center
  • magnetic tape
  • high bandwidth
  • database
  • field effect transistors
  • real time
  • database systems
  • user interface
  • plasma etching