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Impact of the number of chips on the reliability of the solder balls for wire-bonded stacked-chip ball grid array packages.
Yi-Ming Jen
Ying-Lung Wu
Chih-Kai Fang
Published in:
Microelectron. Reliab. (2006)
Keyphrases
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high speed
maximum number
low cost
small number
real time
neural network
information systems
computational complexity
grid computing
high density
software packages
programmable logic