Yi-Ming Jen

Publication Activity (10 Years)

Years Active: 2006-2011
Publications (10 Years): 0

Publications

Yung-Chuan Chiou, Yi-Ming Jen, Shih-Hsiang Huang
Finite element based fatigue life estimation of the solder joints with effect of intermetallic compound growth. Microelectron. Reliab. 51 (12) (2011)
Yi-Ming Jen, Ying-Lung Wu, Chih-Kai Fang
Impact of the number of chips on the reliability of the solder balls for wire-bonded stacked-chip ball grid array packages. Microelectron. Reliab. 46 (2-4) (2006)