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Rationally Designing the Trace of Wire Bonder Head for Large-Span-Ratio Wire Bonding in 3D Stacked Packaging.
Yun Chen
Shuquan Ding
Junyu Long
Maoxiang Hou
Xin Chen
Jian Gao
Yunbo He
Ching-Ping Wong
Published in:
IEEE Access (2020)
Keyphrases
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wire bonding
bond pad
stress response
real time
standard deviation
human head
data sets
neural network
control system
sufficient conditions
experimental data
finite element model
head pose estimation
execution traces
magnetic recording