Thermal Stress and Reliability Analysis of TSV-Based 3-D ICs With a Novel Adaptive Strategy Finite Element Method.
Hao ZhouHengliang ZhuTao CuiDavid Z. PanDian ZhouXuan ZengPublished in: IEEE Trans. Very Large Scale Integr. Syst. (2018)
Keyphrases
- reliability analysis
- finite element method
- heat transfer
- finite element
- power plant
- numerical solution
- diffuse optical tomography
- numerical simulations
- boundary conditions
- temperature field
- finite element model
- boundary element method
- finite element analysis
- numerical methods
- finite difference method
- neural network
- genetic algorithm