Challenges to realize highly reliable SiC power devices: From the current status and issues of SiC wafers.
Junji SenzakiShohei HayashiYoshiyuki YonezawaHajime OkumuraPublished in: IRPS (2018)
Keyphrases
- current status
- highly reliable
- future directions
- key issues
- open issues
- current challenges
- lessons learned
- technical challenges
- practical issues
- open questions
- mobile devices
- technological challenges
- unique features
- fundamental issues
- technical aspects
- issues arise
- integrated circuit
- mobile applications
- power consumption
- computational challenges
- real world
- technical issues
- web services composition
- mobile platforms
- case study
- technical solutions