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A Holistic Modeling and Analysis of Optical-Electrical Interfaces for Inter/Intra-chip Interconnects.

Zhehui WangJiang XuPeng YangLuan Huu Kinh DuongZhifei WangXuan WangZhe WangHaoran LiRafael Kioji Vivas Maeda
Published in: IEEE Trans. Very Large Scale Integr. Syst. (2016)
Keyphrases
  • statistical analysis
  • real time
  • neural network
  • data analysis
  • low cost
  • fiber optic
  • model validation
  • electrical properties