Reconstructing the 3D solder paste surface model using image processing and artificial neural network.
Fang-Chung YangChung-Hsien KuoJein-Jong WingChing-Kun YangPublished in: SMC (3) (2004)
Keyphrases
- surface model
- image processing
- artificial neural networks
- surface reconstruction
- object boundaries
- three dimensional
- machine vision
- digital image processing
- pattern recognition
- neural network
- computer vision
- computer graphics
- high resolution
- disparity map
- multiscale
- active contours
- post processing
- remote sensing
- image registration
- dynamic programming
- image analysis