Flip-chip routing with unified area-I/O pad assignments for package-board co-design.
Jia-Wei FangMartin D. F. WongYao-Wen ChangPublished in: DAC (2009)
Keyphrases
- input output
- ibm power processor
- ibm zenterprise
- high speed
- low cost
- routing algorithm
- analog vlsi
- network topology
- routing problem
- shortest path
- routing protocol
- high density
- circuit design
- software package
- single chip
- unified model
- network topologies
- physical design
- programmable logic
- ad hoc networks
- main memory
- instruction set
- real time
- routing decisions
- ibm eservertm