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Electrical measurement of alignment for 3D stacked chips.
Roberto Canegallo
Mauro Mirandola
Alberto Fazzi
Luca Magagni
Roberto Guerrieri
Karin Kaschlun
Published in:
ESSCIRC (2005)
Keyphrases
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high speed
transmission line
case study
integrated circuit
high density
power distribution
real time
neural network
high end
steady state
input output
dynamic time warping
measurement error
physical characteristics
low voltage
electro mechanical