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Enhanced reliability of hexagonal boron nitride dielectric stacks due to high thermal conductivity.

Xianhu LiangBin YuanYuanyuan ShiFei HuiXu JingMario LanzaFelix Palumbo
Published in: IRPS (2018)
Keyphrases
  • thermal conductivity
  • gate insulator
  • high reliability
  • computer vision
  • artificial intelligence
  • image processing
  • wavelet transform
  • small size