Three-Dimensional Chip-Multiprocessor Run-Time Thermal Management.
Changyun ZhuZhenyu (Peter) GuLi ShangRobert P. DickRuss JosephPublished in: IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. (2008)
Keyphrases
- three dimensional
- management system
- high speed
- information systems
- infrared
- decision making
- low cost
- data management
- data processing
- x ray
- highly parallel
- information management
- analog vlsi
- database machines
- vlsi implementation
- high density
- project management
- finite element analysis
- power consumption
- heat transfer
- multithreading
- virtual reality
- knowledge management
- level parallelism
- real time