FEA Simulations for Thermal Distributions of Large Scale 3DIC Packages.
Suxia ChenQiang WuWayne XunJiachen ZhangJianping XunPublished in: IEEE Access (2024)
Keyphrases
- finite element analysis
- solder ball connect
- small scale
- infrared
- real life
- real world
- probability distribution
- power plant
- software packages
- learning algorithm
- molecular dynamics
- numerical simulations
- simulation model
- exponential distributions
- heavy tailed
- finite element model
- gaussian distribution
- random variables
- similarity measure
- information systems
- information retrieval