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Wayne Xun
ORCID
Publication Activity (10 Years)
Years Active: 2024-2024
Publications (10 Years): 1
Top Topics
Finite Element Model
Real Life
Solder Ball Connect
Exponential Distributions
Top Venues
IEEE Access
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Publications
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Suxia Chen
,
Qiang Wu
,
Wayne Xun
,
Jiachen Zhang
,
Jianping Xun
FEA Simulations for Thermal Distributions of Large Scale 3DIC Packages.
IEEE Access
12 (2024)