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Testing 3-D IC Through-Silicon-Vias (TSVs) by Direct Probing.

Nabeeh KandalaftRashid RashidzadehMajid Ahmadi
Published in: IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. (2013)
Keyphrases
  • integrated circuit
  • high density
  • metal oxide semiconductor
  • test cases
  • database
  • real time
  • real world
  • high speed
  • test set