Anisotropic conductive film & flip-chip bonding for low-cost sensor prototyping on rigid & flex PCB.
Serguei StoukatchNicolas AndréThibault DelhayeFrançois DupontJean-Michel RedoutéDenis FlandrePublished in: IEEE SENSORS (2020)
Keyphrases
- low cost
- real time
- single chip
- data acquisition
- low power
- image sensor
- sensor data
- cmos image sensor
- printed circuit boards
- hardware and software
- digital camera
- sensor networks
- low power consumption
- defect detection
- anisotropic diffusion
- rapid prototyping
- three dimensional
- sensor fusion
- embedded systems
- dynamic range
- highly efficient
- multi sensor
- high speed
- motion picture
- development process
- analog vlsi
- diffusion filtering