A 3 Megapixel 100 Fps 2.8 µm Pixel Pitch CMOS Image Sensor Layer With Built-in Self-Test for 3D Integrated Imagers.
Shang-Fu YehChih-Cheng HsiehKa-Yi YehPublished in: IEEE J. Solid State Circuits (2013)
Keyphrases
- image sensor
- cmos image sensor
- solid state
- dynamic range
- single chip
- video camera
- low power
- frame rate
- high speed
- real time
- built in self test
- digital camera
- low cost
- hardware and software
- processing capabilities
- image processing algorithms
- sensor technology
- pixel level
- imaging systems
- machine vision
- denoising
- image sequences