A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending.
Leon XuTommi ReinikainenWei RenBo Ping WangZhenxue HanDereje AgonaferPublished in: Microelectron. Reliab. (2004)
Keyphrases
- multi objective
- solder ball connect
- evolutionary algorithm
- multi objective optimization
- optimization algorithm
- objective function
- infrared
- multiple objectives
- genetic algorithm
- multiobjective optimization
- particle swarm optimization
- nsga ii
- conflicting objectives
- evolutionary optimization
- pareto optimal
- multi objective optimization problems
- optimum design
- multiobjective evolutionary algorithm
- bi objective
- bulletin board
- multi objective optimisation
- multi objective evolutionary algorithms
- simplex method
- design automation
- high temperature
- genetic programming