Login / Signup
Noise coupling due to through silicon vias (TSVs) in 3-D integrated circuits.
Emre Salman
Published in:
ISCAS (2011)
Keyphrases
</>
integrated circuit
metal oxide semiconductor
random noise
high speed
missing data
noisy data
signal to noise ratio
low cost
noise level
high density
noise model
noise reduction
gaussian noise
additive noise