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Noise coupling due to through silicon vias (TSVs) in 3-D integrated circuits.

Emre Salman
Published in: ISCAS (2011)
Keyphrases
  • integrated circuit
  • metal oxide semiconductor
  • random noise
  • high speed
  • missing data
  • noisy data
  • signal to noise ratio
  • low cost
  • noise level
  • high density
  • noise model
  • noise reduction
  • gaussian noise
  • additive noise