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Thermally expanded core fiber with a 4-μm mode field diameter suitable for low-loss coupling with silicon photonic devices.
Takuya Oda
Keisuke Hirakawa
Kentaro Ichii
Satoshi Yamamoto
Kazuhiko Aikawa
Published in:
OFC (2017)
Keyphrases
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high speed
infrared
mobile devices
high levels
semiconductor devices
neural network
artificial intelligence
information systems
low cost
high density
physical characteristics