Localized thermal effect of sub-16nm FinFET technologies and its impact on circuit reliability designs and methodologies.
Yongsheng SunCanhui ZhanJianping GuoYiwei FuGuangming LiJun XiaPublished in: IRPS (2015)
Keyphrases
- nm technology
- silicon on insulator
- negative impact
- cmos technology
- data mining
- high speed
- design principles
- electronic circuits
- power consumption
- real world
- thermal imaging
- agent based systems
- design tools
- low power
- infrared
- artificial intelligence
- failure rate
- negative effects
- internet enabled
- extreme programming
- information systems
- neural network