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Device performance analysis on 20nm technology thin wafers in a 3D package.
Sukeshwar Kannan
Rahul Agarwal
Arnaud Bousquet
Geetha Aluri
Hui-Shan Chang
Published in:
IRPS (2015)
Keyphrases
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nm technology
power consumption
low power
integrated circuit
software package
portable devices
computer vision
image processing
semiconductor manufacturing
active contours
electron beam
power dissipation