Liquid-Metal Vertical Interconnects for Flip Chip Assembly of GaAs C-Band Power Amplifiers Onto Micro-Rectangular Coaxial Transmission Lines.
Parrish RalstonMarcus OliverKrishna VummidiSanjay RamanPublished in: IEEE J. Solid State Circuits (2012)
Keyphrases
- power distribution
- transmission line
- fiber optic
- field effect transistors
- high density
- high power
- microstrip
- power dissipation
- patch antenna
- electrical power
- power consumption
- power system
- differential equations
- low power
- chip design
- wave propagation
- dual band
- low cost
- printed circuit boards
- ibm power processor
- high speed
- input output
- cmos technology
- waveguide
- dynamic characteristics
- thin film
- steady state
- data center
- multi band
- magnetic field
- neural network
- gallium arsenide
- room temperature
- operating conditions
- dynamical systems
- computational intelligence