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Expanded-Beam Through-Substrate Coupling Interface for Alignment Tolerant Packaging of Silicon Photonics.
Nivesh Mangal
Jeroen Missinne
Gunther Roelkens
Joris Van Campenhout
Geert Van Steenberge
Brad Snyder
Published in:
OFC (2018)
Keyphrases
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high density
high speed
magnetic recording
semiconductor devices
liquid crystal
user interface
electron beam
image alignment
low cost
dynamic time warping
visual interface
genetic algorithm
sequence alignment
direct manipulation
low power
user friendly
friendly interface