Research on Thermal Coupling Modeling for Multi-chip Paralleled IGBT Modules Based on Thermal Resistance Network.

Yang Zhou Zhijun Bai

Published in: ICISCAE (2023)

Keyphrases

infrared
network model
low cost
visible spectrum
neural network
finite element analysis
solder ball connect
high temperature
high bandwidth
functional modules
complex networks
network structure
high speed
control system
community structure
network simulator
modular structure
electrical properties