Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems.
Kenji OkabeHoragodage Prabhath JeewanShota YamagiwaTakeshi KawanoMakoto IshidaIppei AkitaPublished in: Sensors (2015)