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Optimizing DSA-MP decomposition and redundant via insertion with dummy vias.

Chung-Yao HungPeng-Yi ChouWai-Kei Mak
Published in: ASP-DAC (2017)
Keyphrases
  • high density
  • integrated circuit
  • decomposition method
  • highly redundant
  • image decomposition
  • real world
  • machine learning
  • knowledge base
  • three dimensional
  • expert systems
  • multiresolution
  • decomposition algorithm